3M™ Thermal Bonding Film 583 provides a strong, permanent bond to the surface to which it is applied.
This film is ideal for low temperature bonding applications: such as bonding flex antenna and metal face plates to a chassis, or splicing glass fabric in PCB board manufacturing.
It’s a nitrile phenolic based thermosetting adhesive film that can be heat or solvent activated (in the uncured form), or lightly crosslinked using a post heat exposure.
The film can be die-cut and gives a slight surface tack.
It works highly effectively on a variety of substrates, is reworkable and demonstrates excellent performance in drop tests.
